EMI / RFI / ESD Shielding
EMI / RFI Electro Magnetic Interference and Radio Frequency Interference are world wide interchangeable acronyms to describe the characteristic of an electronic circuit to emit or absorb radiation (in the form of radio waves) into or from a local environment.
The development of high frequency electronics has resulted in the US, virtually all European and many Asian governments to establish limits as to how much and at what frequency an electronic device may emit radiation into the local environment.
Virtually all modern devices containing electronic circuits will emit radio waves and have some degree of susceptibility to performance failure from outside radiation sources. Therefore by government fiat all electronic devices must not emit signals above a threshold level or be shielded to prevent such emissions from exceeding appropriate standards.
Additional Standards may require "Susceptibility" testing be performed to ensure that an electronic device, in the presence of external radiation, continue to operate to minimum specifications without compromise to a product's efficacy.
This secondary, but no less important requirement recognizes that the same local environment of regulated and unregulated radio waves may enter an electronic enclosure. This un fettered entry into an electronic device, particularly medical devices, can cause extreme unwanted ramifications to a device's normal performance capabilities.
Regardless of a device's compliance to emission requirements, the effect of external signals entering an electronic enclosure are every bit as important as emission issues. Companies supplying electronic devices must ensure a product's minimum standard of performance is not compromised in its expected operating enviroment.
ESD, Electro Static Dissipation represents a common and insidious cause for electronic circuit failure in many devices. Frequently misunderstood, the coupling of a high voltage charge normally from a person to an electronic device can and does cause catastrophic failure of IC components. The failure occurs when the device is subjected to static transfer voltages measured to be as high as 25,000 or higher volts.
Solution The deposition of Elamet, a highly conductive thin film coating is an exceptionally efficient method for providing for the highest levels of EMI/RFI and ESD control.